Allen Chang
Sr. Assembling Engineer at xMEMS
Taoyuan City, Taiwan
Summary
👤
Senior🎓
Top SchoolAllen Chang is a senior semiconductor packaging engineer based in Taoyuan City, Taiwan, with over 15 years’ domain expertise and eight years in specialized packaging roles driving MEMS and advanced-package NPI. He leads package architecture, assembly process integration, and qualification from concept to high-volume manufacturing, balancing performance, reliability, manufacturability and cost. Skilled in SiP, FCCSP, FCBGA, WBBGA, QFN/DFN, warpage/thermal/mechanical simulation, and DOE-driven yield improvement, he excels at OSAT collaboration and supplier risk mitigation. At xMEMS he has steered MEMS packaging development and NPI execution, bringing practical DFM judgment and deep hands-on assembly process know-how to cross-functional product teams. A chemical engineering graduate from Yuan-Ze University, he combines materials/process insight with packaging architecture acumen—often spotting manufacturability constraints early that prevent costly rework downstream.
8 years of coding experience
6 years of employment as a software developer
學士, 化學工程學系, 學士, 化學工程學系 at Yuan-Ze University
Github Skills (2)
linux10
firmware10
Programming languages (1)
Github contributions (3)
allenboon/fwupd
Apr 2021 - Apr 2021
A simple daemon to allow session software to update firmware
Contributions:2 pushes in 1 day
daemonfirmware-updateupdatefirmware
fwupd/fwupd
Feb 2021 - Jun 2022
A system daemon to allow session software to update firmware
Contributions:1 review, 9 commits, 8 PRs in 1 year 4 months
firmwareupdateclinux
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