Amir Farrokhpanah is a thermal engineer with nine years of experience designing high-performance thermal solutions for silicon and battery systems. Currently at Apple, he architects die- and package-level thermal models and advises IC floor-planning to balance energy efficiency and performance scaling. Previously he led thermo-mechanical design and control strategies for Lucid Motors' high-voltage battery pack and built multiphase heat-transfer solvers in C++/CUDA during research collaborations with Autodesk. His background spans PhD-level research at the University of Toronto and postdoctoral work on advanced oxide deposition processes, giving him a rare blend of device-level materials expertise and system-level thermal architecture. Based in San Jose, he focuses on translating complex thermal physics into practical engineering choices that unlock higher chip performance. Not obvious from the title: he pairs academic rigor with hands-on solver development, enabling both predictive modeling and production-ready design guidance.
9 years of coding experience
10 years of employment as a software developer
Master's degree, Mechanical Engineering, 4/4, Master's degree, Mechanical Engineering, 4/4 at University of Toronto
Contributions:7 commits, 3 pushes, 1 branch in 1 year 6 months
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