Summary
Andreas Klipp is a technology leader with a PhD in inorganic chemistry and over two decades of experience in semiconductor materials and R&D management. He currently heads global technology for Advanced Cleaning, Etching and Photo Ancillaries at BASF Electronic Materials, having risen through roles that combined hands-on process development with program and budget leadership. His background includes early CVD process engineering at Infineon and gap-filling dielectric projects at Qimonda, giving him deep expertise in low-k dielectrics, CVD, and next-generation gap-fill solutions. Andreas has coordinated collaborative development programs with industry and research partners and is inventor/co-author on several patents and publications. Known for bridging fundamental chemistry with scalable manufacturing, he brings both laboratory rigor and strategic program delivery to complex IC copper technology challenges. Based in Germany, he thrives at the intersection of materials science and industrial-scale semiconductor innovation.
10 years of coding experience
7 years of employment as a software developer
PhD in Chemistry, Inorganic Chemistry, PhD in Chemistry, Inorganic Chemistry at Universität Bielefeld