Summary
Andrew Raseley is a Principal Engineer with over a decade of hands-on experience designing and commercializing systems-level solutions for high-data-rate optical communications and advanced semiconductor packaging. He has led architecture, firmware, test automation, NPI, and manufacturing-yield improvements across 100G–800G+ modules and heterogeneous PIC-based subsystems, blending hardware, firmware, and systems engineering. At BRIDG he now helps on-shore advanced interposer and packaging technologies while previously driving firmware and automated test systems that bridged lab prototypes to high-yield production. Colleagues rely on him to translate complex optical and packaging constraints into practical, MSA-compliant control interfaces and manufacturable assemblies. He brings a pragmatic, cross-disciplinary approach—equally comfortable debugging DSP/optical metrics as scripting factory automation—and enjoys collaborating across organizations to push emerging packaging and photonics technology forward. Based in Allentown, PA, he pairs a Lehigh Computer Engineering foundation with a track record of improving yields and enabling customers through robust product engineering.
10 years of coding experience
10 years of employment as a software developer
Pleasant Valley High School
Bachelor of Science (B.S.), Computer Engineering, Bachelor of Science (B.S.), Computer Engineering at Lehigh University