Ankur Agrawal
IC Packaging Engineer at Apple
Cupertino, California, United States
Summary
👤
Senior🎓
Top SchoolAnkur Agrawal is an IC packaging engineer and hands-on technical leader with 11+ years driving package design for manufacturability, process development, and reliability across 2D/2.5D/3D and silicon photonics products. He has led cross-geo teams and OSAT/substrate vendor engagements from concept through HVM, delivering qualified pluggable transceivers (100G–800G), pioneering co-packaged optics demos, and enabling LiDAR photonic IC assembly. At Intel he reduced design timelines, standardized package design rules, and blended hardware, firmware, and systems work to ship high-performance reference platforms; he now applies that multidisciplinary practice at Apple in Cupertino. Trained as a PhD chemical engineer from Georgia Tech with an IIT Kanpur B.Tech, he combines deep materials/process insight with system-level product delivery—and, off the clock, enjoys building hardware and writing the code that runs it.
11 years of coding experience
20 years of employment as a software developer
Doctor of Philosophy (Ph.D.) Chemical Engineering, Doctor of Philosophy (Ph.D.) Chemical Engineering at Georgia Institute of TechnologyIndian Institute of Technology Kanpur
English, Hindi
Github Skills (16)
python10
kubernetes9
voice-commands5
voice-assistant4
natural-language-understanding3
voice3
voice-control3
voice-recognition3
vui3
keyword-spotting2
tensorflow2
speech-to-text2
machine-learning2
speech-recognition2
deep-learning2
Programming languages (4)
Github contributions (5)
ankurag12/Electronic-Paper-Display-Bluetooth
Sep 2015 - Dec 2015
Contributions:11 commits, 3 branches in 3 months
ankurag12/flippy
Apr 2018 - Dec 2020
Contributions:2 PRs, 69 pushes, 3 branches in 2 years 8 months
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