Summary
Ardalan Nasiri is a Senior Substrate Engineer in Houston with nine years of hands-on experience designing RF substrates, advanced laminate and PCB substrates, and electronic packaging for mobile, automotive, aerospace, and defense markets. He holds a PhD in Electrical and Electronics Engineering and combines deep academic R&D—including NASA-funded high-temperature electronics and ceramic nanomaterials—with industry-scale NPI-to-HVM program leadership at GlobalFoundries and Qorvo. Ardalan is skilled in DFM, FMEA, reliability testing, flip-chip and 2.5D/3D packaging, and routinely drives cross-functional supplier and customer technical discussions to deliver manufacturable solutions. Beyond packaging, his background spans photonics, thin-film processes, and power systems, reflecting a rare blend of materials science and practical production engineering. Colleagues rely on him to translate demanding environmental and reliability requirements into robust substrate technologies that scale to high-volume manufacturing.
9 years of coding experience
12 years of employment as a software developer
Master's degree Photonics Engineering, Master's degree Photonics Engineering at University of Technology
Bachelor's degree Engineering Physics/Applied Physics, Bachelor's degree Engineering Physics/Applied Physics at Shiraz University
Ph.D. Electrical and Electronics Engineering, Ph.D. Electrical and Electronics Engineering at University of Arkansas