Summary
Bo-wei Tseng is a Senior Machine Learning Engineer with eight years of experience building production-grade AI systems and leading cross-functional teams at MediaTek. He combines deep research expertise in privacy-preserving ML—authoring a published master’s thesis on Compressive Privacy GANs—with hands-on engineering delivering Mediatek’s in-house foundation model and lightweight ML integrations for modem chips. His work has measurably improved engineer productivity, power consumption, spectral efficiency, and verification throughput across real-world field trials and RTL workflows. Comfortable spanning research, deployment, and chip-aware optimization, he has shipped model compression, quantization and TFLM/Torch-runtime solutions for constrained devices. He also contributes technical peer review to IEEE journals, signaling continued engagement with the research community while driving applied GenAI and AI-aided design initiatives. Unexpectedly for an industry engineer, he was the sole non-PhD contributor in early international research collaborations, demonstrating strong communication and rapid technical growth.
8 years of coding experience
1 year of employment as a software developer
學士, ENGINEERING, 學士, ENGINEERING at 大葉大學
碩士, 電信工程學系, 碩士, 電信工程學系 at 國立臺灣大學
English, Chinese