Bolin Chen is a TD Module & Integration Yield Engineer at Intel with 11 years of experience bridging academic research and industrial yield improvement. He holds a PhD in Mechanical Engineering from Iowa State University and built deep expertise in printable flexible electronics—designing inkjet-printed thermoelectric generators and 3D-printed supercapacitors while formulating functional inks. Bolin’s background spans postdoctoral work at national labs and the University of Chicago to hands-on quality engineering at BMW, giving him a rare mix of advanced materials science, manufacturing process control, and QA systems experience. At Intel he applies this cross-disciplinary skill set to improve module integration yields, leveraging data analysis and electrochemical knowledge to solve production-scale problems. Known for turning lab-scale inventions into robust, manufacturable solutions, he combines experimental rigor with practical process optimization.
11 years of coding experience
6 years of employment as a software developer
Doctor of Philosophy (PhD), Mechanical Engineering, Doctor of Philosophy (PhD), Mechanical Engineering at Iowa State University
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