Bolin Chen

TD Module & Integration Yield Engineer

United States
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Summary

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Senior
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Top School
Bolin Chen is a TD Module & Integration Yield Engineer at Intel with 11 years of experience bridging academic research and industrial yield improvement. He holds a PhD in Mechanical Engineering from Iowa State University and built deep expertise in printable flexible electronics—designing inkjet-printed thermoelectric generators and 3D-printed supercapacitors while formulating functional inks. Bolin’s background spans postdoctoral work at national labs and the University of Chicago to hands-on quality engineering at BMW, giving him a rare mix of advanced materials science, manufacturing process control, and QA systems experience. At Intel he applies this cross-disciplinary skill set to improve module integration yields, leveraging data analysis and electrochemical knowledge to solve production-scale problems. Known for turning lab-scale inventions into robust, manufacturable solutions, he combines experimental rigor with practical process optimization.
code11 years of coding experience
job6 years of employment as a software developer
bookDoctor of Philosophy (PhD), Mechanical Engineering, Doctor of Philosophy (PhD), Mechanical Engineering at Iowa State University
languagesChinese, English
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Github Skills (105)

editor9
realtime9
steganalysis9
visual-studio9
microsoft9
npm9
visual-studio-code9
react9
electron9
vscode-extension9
typescript9
nodejs9
vscode9
mongodb9
reactive-programming8

Programming languages (7)

TypeScriptC++RustJavaScriptHTMLJupyter NotebookPython

Github contributions (5)

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An audio steganalysis method based on CNN in the time domain.
Contributions:6 commits, 5 pushes, 1 branch in 1 year 6 months
deep-learningmethodaudiodomainsteganalysis
Contributions:7 commits, 4 pushes in 2 months
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Bolin Chen - TD Module & Integration Yield Engineer