Summary
Boyang Wang is a Senior Hardware Engineer with a Ph.D. in Electrical Engineering and nine years of experience bridging signal processing, machine learning, and hardware/software codesign to deliver real-world systems. He has led high-performance ultrasonic communication platforms and protocol work praised as pioneering by Sigma Xi, earning awards from Sigma Xi/IIT and the IEEE Ultrasonics Symposium. With 29 publications and extensive mentorship of graduate students, he combines deep research rigor with hands-on engineering at Huawei and national labs. Known as a fast learner and communicative teammate, he excels at turning algorithmic advances into deployable embedded solutions and often applies ML-driven equalization and deconvolution techniques to improve communication robustness. An uncommon strength is his track record of guiding student teams to prize-winning projects while managing complex schedules and multidisciplinary integration.
9 years of coding experience
7 years of employment as a software developer
Master of Science, Electrical and Electronics Engineering, second year, Master of Science, Electrical and Electronics Engineering, second year at Illinois Institute of Technology
Bachelor's degree, School of Information and Electronics, Bachelor's degree, School of Information and Electronics at Beijing Institute of Technology
English, Chinese