Brian Smith
Sr Director, Distinguished Embedded Software Engineer at Magic Leap
West Palm Beach, Florida, United States
Summary
👤
Senior🎓
Top SchoolBrian Smith is a seasoned embedded software leader with over two decades of experience architecting camera, sensor and wireless subsystems for mobile and wearable devices. As Sr. Director and Distinguished Embedded Software Engineer at Magic Leap he leads cross-continental teams developing wearable/host interfaces, camera ISPs, sensor fusion and regulatory-compliant factory calibration for next-generation AR devices. His background spans camera AF/AEC algorithms, ISP pipelines, RTOS drivers, power and thermal management, and real-time sensor streaming—skills honed at Motorola where he delivered shipping autofocus, WLAN and multimedia systems across multiple SoCs. Brian holds an M.S. in Electrical Engineering and combines deep low-level DSP and BSP expertise with product-focused systems architecture, mentoring, and CI/test automation. Notably, he has a strong patent portfolio and a track record of bridging algorithm teams with silicon partners (NVIDIA, AMD) to turn research into production-quality embedded software.
13 years of coding experience
26 years of employment as a software developer
Master of Science Electrical Engineering, Master of Science Electrical Engineering at The University of Texas at ArlingtonBachelor of Science Electrical Engineering, Bachelor of Science Electrical Engineering at University of Central Florida
Github Skills (6)
moto8
sourceforge7
kernel5
tar5
linux3
linux-kernel2
Github contributions (5)
razrqcom-dev-team/android_kernel_motorola_msm8226
Apr 2013 - Dec 2013
Contributions:35 commits in 8 months
kernelmotosourceforgelinuxhttp-kernel
CyanogenMod/android_kernel_motorola_msm8226
Apr 2013 - Dec 2013
Contributions:18 commits in 8 months
kernelmotosourceforgelinuxhttp-kernel
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