Chang Lin is a Senior Product Development Engineer with over a decade of experience driving high-volume manufacturing and packaging solutions at Intel, based in Portland, Oregon. He bridges customers and factories to take products from concept through PCB/SMT, mechanical and system assembly, to failure analysis and reliability testing, while leading DFX/DFM, BOM management, DOE and corrective actions. His background in SOC packaging R&D and hands-on process certification gives him deep expertise in materials, process validation, and OEM/ODM support for HVM. A Ph.D. in Mechanical Engineering underpins his analytical approach to root-cause analysis and process optimization. Notably, he combines research rigor with production-scale execution, consistently translating complex engineering requirements into manufacturable, reliable products.
5 years of coding experience
6 years of employment as a software developer
Ph.D, Mechanical Engineering, Ph.D, Mechanical Engineering at Auburn University
Intel staging area for llvm.org contribution. Home for Intel LLVM-based projects.
Contributions:2 reviews, 2 PRs, 3 comments in 3 years 3 months
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Chang Lin - Senior Product Development Engineer at Intel Corporation