Summary
Cheng-kang Huang is a Process Integration Engineer at TSMC with 11 years’ experience bridging mechanical design and advanced semiconductor packaging, specializing in CoWoS (2.5D), SoIC (3D), TSV, and HBM projects across N3P/N5/N12 nodes. He began his career in mechanical engineering and product development—leading designs for notebooks, CNC controllers, and robotic systems—which gives him a rare cross-domain fluency from CAD and manufacturing to wafer-level integration. Proficient in CREO and SolidWorks, he has hands-on experience in material processing, plastic injection modeling, metal stamping, casting, and CNC, enabling practical solutions that ease scale-up to production. At TSMC he applies that manufacturing-first mindset to process integration challenges, focusing on yield, assembly robustness, and interposer/mechanical reliability. Outside work he codes and photographs, reflecting a detail-oriented mindset and visual intuition that often informs his mechanical problem solving. Colleagues describe him as a pragmatic engineer who translates complex packaging constraints into manufacturable designs.
10 years of coding experience
4 years of employment as a software developer
碩士, 動力機械工程學系, 碩士, 動力機械工程學系 at 國立清華大學