Chi-feng Pai is a senior manager and materials-physics expert with nine years of industrial and academic experience in magnetic memory and spintronics, now leading forward-looking HKMG tool and module development at TSMC. He bridges fundamental research and device integration—spanning spin-orbit torque, Dzyaloshinskii-Moriya interactions, and MRAM technologies—built on a PhD from Cornell and postdoctoral work at MIT. Formerly an associate professor at National Taiwan University and a long-term collaborator with industry labs, he combines nanofabrication and thin-film materials engineering to translate novel device physics into scalable processes. An active contributor to the IEEE Magnetics Society in Taiwan, he uniquely pairs hands-on lab proficiency with program-level leadership across corporate research and academic settings. Although an enthusiastic but self-described amateur coder on GitHub, his strength lies in turning complex materials insights into manufacturable transistor and memory solutions.
9 years of coding experience
16 years of employment as a software developer
BSc and BEng Physics and MSE, BSc and BEng Physics and MSE at National Taiwan University
PhD Applied and Engineering Physics, PhD Applied and Engineering Physics at Cornell University
Contributions:15 commits, 14 pushes, 1 branch in 1 day
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