Chia-jung Yang is a Product Engineer at TSMC with 13 years in semiconductor process and advanced packaging, specializing in InFO/CoWoS and N7/N3 node technologies. He combines deep failure-analysis expertise across CP test, layout, and process teams with hands-on DOE and CIP work to tighten process windows and boost yield. Known as a strong team player and cross-team bridger, he has supported customer bring-ups for AI chips, GPS, Wi‑Fi, mobile and SoC applications and resolved thorny issues like thermal sensor mismatch and SRAM leakage. With a master’s in Optoelectronics, he brings a research-led mindset to practical fab challenges, often translating root-cause insights into robust process controls. Based in Taichung, he pairs methodical experimental rigor with pragmatic customer-facing problem solving.
Contributions:17 pushes, 1 branch in 3 years 4 months
Find and Hire Top DevelopersWe’ve analyzed the programming source code of over 60 million software developers on GitHub and scored them by 50,000 skills. Sign-up on Prog,AI to search for software developers.