Senior Package Development Engineer at Bosch Taiwan
New Taipei, Taiwan
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Summary
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Chih-hao Yu is a Senior Package Development Engineer with 11 years of experience specializing in MEMS sensor packaging, wafer sort, and advanced assembly techniques for automotive and consumer markets. At Bosch Taiwan he led development of high-performance inertial and automotive pressure sensors, introduced novel wafer dicing solutions, and drove material/process changes for leading smartphone and vehicle customers. He combines hands-on package design and process characterization with DOE-driven statistical problem solving and cross-functional product management honed at OSAT and test-house environments. Comfortable under tight deadlines, he has a track record of taking prototypes to volume production and improving yield through systematic risk management and tooling/process innovation. Uncommonly for a packaging engineer, he pairs deep device-level expertise with experience in laminated substrate layout and front-end simulation/verification from his earlier probecard and RD work. Based in New Taipei, Taiwan, he brings both technical depth and pragmatic delivery to complex sensor programs.
11 years of coding experience
4 years of employment as a software developer
MS, Electrical and Electronics Engineering, MS, Electrical and Electronics Engineering at Duke University
Bachelor of Science (BS), Engineering and System Science, Bachelor of Science (BS), Engineering and System Science at National Tsing Hua University
Contributions:29 commits, 42 pushes, 2 branches in 2 months
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Chih-hao Yu - Senior Package Development Engineer at Bosch Taiwan