Daniel Lenski is a Principal Engineer with a Physics PhD and 15 years of experience applying data science, numerical modeling, and software engineering to semiconductor yield, failure analysis, and scalable backend systems. He blends hands-on firmware and embedded work (notably contributions adding AMIC SPI flash support to the widely used flashrom project) with cloud-scale database and service engineering from roles at AWS and SandboxAQ. Comfortable across Python, C, C#, Kotlin and SQL, he builds reproducible data pipelines, automated analysis, and reliable production services that bridge lab measurements and operational products. A proven collaborator and communicator, he accelerates cross-disciplinary teams in fast-moving manufacturing and research environments. Fluent in multiple languages and authorized to work in the US and Canada, he enjoys reverse-engineering tricky problems and translating physical insights into pragmatic software.
15 years of coding experience
18 years of employment as a software developer
Bachelor of Arts Physics Linguistics, Bachelor of Arts Physics Linguistics at Cornell University
PhD Physics, PhD Physics at University of Maryland
Send patches to https://review.coreboot.org: https://www.flashrom.org/Development_Guidelines#GitHub
Role in this project:
Embedded Systems Engineer / IoT Developer
Contributions:5 commits in 1 year 7 months
Contributions summary:Daniel's contributions focused on adding support for various AMIC SPI flash memory chips to the flashrom project. This involved implementing the necessary code to identify, read, write, and erase these specific memory chips, and also added support for other related chips. Furthermore, the user contributed to supporting specific boards and implemented a warning system for One-Time Programmable (OTP) memory chips within the flash chips.
Provision an RSA SecurID token with RSA's CT-KIP protocol
Contributions:1 release, 77 commits, 4 PRs in 3 years 3 months
cryptographyrsatokenprovisionkip
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Daniel Lenski - Principal Engineer, Yield Analysis at INFICON