Danqi Wang is a Technical Program Manager in Fremont with a decade of experience bridging materials science and semiconductor product development. She has driven reliability improvements and high-volume manufacturing readiness at leading equipment and wafer fab suppliers, pairing deep failure-analysis expertise from a PhD in Materials Science with hands-on program leadership. Her background includes improving instrument utilization and supplier qualification processes, running root-cause and corrective-action programs, and translating complex lab characterization (SEM/TEM/XRD/APT) into production-ready solutions. Comfortable negotiating with vendors and cross-functional stakeholders, she combines technical rigor with pragmatic project execution and an MBA-informed grasp of business priorities. A not-obvious strength is her track record of boosting lab instrument use by 50% through outreach and training—evidence of her ability to grow capability as well as manage delivery.
8 years of coding experience
14 years of employment as a software developer
Master of Science (MS), Materials Science, 3.9/4.0, Master of Science (MS), Materials Science, 3.9/4.0 at Case Western Reserve University
Bachelor of Science (BS), Materials Science, 3.7/4.0, Bachelor of Science (BS), Materials Science, 3.7/4.0 at Tianjin University
LPI-HyADBS: A hybrid framework integrating feature extraction based on AdaBoost, and classification models including DNN, XGBoost, and SVM used to predict LPIs
Contributions:6 pushes, 9 branches in 2 years 10 months
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Danqi Wang - Technical Program Manager at Applied Materials