Defang Chen is an R&D manager at TSMC with over 16 years of hands-on experience in advanced semiconductor process integration, specializing in deposition, lithography and etch patterning. He has led teams delivering leading-edge etch process development, shepherding multiple FEOL generations and pioneering double patterning (LELE, SADP) into production. His work spans failure analysis, device performance boosting, and transferring complex processes and hardware into high-volume fabs. While based in Taiwan, he has international experience from an overseas assignment in the Bay Area managing joint development and live demo projects with suppliers. He also applies data-driven methods—wafer-level data mining and machine learning—to optimize process and equipment integration for manufacturability.
8 years of coding experience
5 years of employment as a software developer
Master's degree, Chemical Engineering, Master's degree, Chemical Engineering at National Taiwan University
Contributions:32 commits, 37 pushes, 4 comments in 2 years 4 months
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