Summary
Dj Hong is a seasoned semiconductor packaging and substrate technologist with over two decades of hands-on experience in high-volume manufacturing, materials development, and process integration across leaders like LG Innotek, AT&S, Doosan, and Samsung Electro-Mechanics. Currently leading FCBGA HVM yield improvement, he has driven next-generation substrate projects, PLP material innovations, and factory setups for advanced packages such as FCBGA, FCLGA, and FCCSP. Known for bridging R&D and production, Dj combines deep wet-process expertise (lithography, copper plating, etching, solder mask) with program leadership in both wireline and wireless semiconductor markets. His background in polymer science and chemistry underpins successful new-material introductions and complex yield ramp challenges. Less obvious: he repeatedly moves between technical leadership and industrial engineering roles, reflecting a rare blend of laboratory development skills and large-scale manufacturing optimization.
8 years of coding experience
25 years of employment as a software developer
Bachelor's degree, Chemistry, Bachelor's degree, Chemistry at Chungnam National University
Master's degree, polymerscience Engineering, Master's degree, polymerscience Engineering at Sungkyunkwan University
Korean, English