Summary
Dylan Wang is a semiconductor engineering leader with over 20 years in engineering and 15 years focused in the semiconductor industry, currently serving as Assistant Director leading Manufacturing Process & Engineering for Asia at Corning. He has deep expertise across wafer finishing, process integration, yield enhancement and customer-facing field application engineering, driving Cpk and device-yield improvements from early nodes through advanced processes. Dylan has led cross-functional teams and critical customer programs at GLOBALFOUNDRIES, UMC and SunEdison, combining hands-on module engineering with roadmap planning, NPI and cost-down initiatives. He holds an MBA from BI Norwegian Business School and a chemical engineering background, blending technical problem-solving with growing management and business acumen. A practical technologist, he’s known for translating cleanliness, metrology and process control improvements into measurable yield gains across 300mm and polishing/epi material environments.
8 years of coding experience
4 years of employment as a software developer
Bachelor's degree, Chemical Engineering, Bachelor's degree, Chemical Engineering at National Cheng Kung University
Master of Business Administration - MBA, Business Administration, Management and Operations, Master of Business Administration - MBA, Business Administration, Management and Operations at BI Norwegian Business School
English, Chinese