Gopinath Danda
Module Integration Yield Engineer
Philadelphia, Pennsylvania, United States
Summary
👤
Senior🎓
Top SchoolGopinath Danda is a Module Integration Yield Engineer at Intel with 11 years of experience bridging deep academic research and high-volume semiconductor development. He holds a Ph.D. in Electrical and Electronics Engineering from the University of Pennsylvania and has hands-on expertise in nanoscale fabrication, nanopore sensing, and multi-physics modelling from his graduate research. At Intel he focuses on next-generation processors, applying rigorous experimental design and yield optimization to complex module integration challenges. Comfortable moving between lab-scale materials work and production-scale process control, he brings a rare combination of nanotechnology insight and program-level project management. Colleagues benefit from his ability to translate advanced device physics into practical, manufacturable solutions.
11 years of coding experience
6 years of employment as a software developer
High School, High School at St. Thomas' Boys' SchoolBachelor’s Degree, Electronics and Communications Engineering, Bachelor’s Degree, Electronics and Communications Engineering at Kalinga Institute of Industrial Technology, BhubaneswarDoctor of Philosophy (Ph.D.), Electrical and Electronics Engineering, Doctor of Philosophy (Ph.D.), Electrical and Electronics Engineering at University of Pennsylvania
English, Hindi, Bengali, Spanish
Stackoverflow
184reputation
28kreached
7answers
3questions
Github Skills (7)
objective-c6
jquery6
getjson6
database6
joomla6
cordova6
dropbox6
Github contributions (5)
gopinathdanda/create-your-own-adventure
Jan 2015 - Aug 2015
Contributions:15 commits, 14 pushes, 1 comment in 7 months
gopinathdanda/j-vision
Mar 2016 - Sep 2019
Contributions:38 pushes, 1 branch in 3 years 6 months
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