Heehun Bae is a Principal Research Engineer with 9 years of experience specializing in electronic materials for semiconductor packaging and the automotive industry. Based in Gyeonggi, South Korea, he leads development of die-attach Cu sintering pastes, evaluates electrochemical migration in MLCCs, and analyzes ceramic substrates such as AMB AlN for power modules at Hyundai MOBIS. His background includes flip-chip package development at STATS ChipPAC and earlier display panel R&D at LG Display, grounded in a Materials Science and Engineering education from Purdue University. Heehun combines hands-on materials synthesis and reliability testing with predictive failure analysis, bridging lab-scale innovation to automotive-grade production. A practical problem solver, he often translates subtle failure mechanisms into design changes that improve long-term power-module robustness.
9 years of coding experience
2 years of employment as a software developer
Master's degree, Materials Science Engineering, Master's degree, Materials Science Engineering at Purdue University
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