Summary
Hoyeonjiki Kim is an Embedded System Engineer with nine years of experience specializing in Board Support Package (BSP) development at Telechips Inc. Based in Seoul, he brings a strong academic foundation from Kookmin University (BSc, MSc) and hands-on research experience from UC Irvine in computer science. He focuses on low-level firmware, hardware-software integration, and optimizing boot and driver stacks for automotive and consumer SoCs. Known for bridging research insights with practical BSP delivery, he often translates complex hardware constraints into maintainable software layers. Colleagues value his steady delivery on long-lived embedded projects and his knack for identifying subtle timing and resource bottlenecks early in development. He combines deep technical rigor with a pragmatic engineering mindset suited for production-grade embedded systems.
9 years of coding experience
Bachelor's degree, Computer Science, Bachelor's degree, Computer Science at Kookmin University
University of California, Irvine