Summary
Igor Loi is a Senior IC Designer with eight years of hands-on experience driving front-end ASIC development from RTL to GDSII, currently based in Grenoble and recently joining Essilor Group. He has led RTL development, IP integration, verification, synthesis, SDC/UPF and power analysis across three product-grade tape-outs (65nm and multiple FDSOI nodes), and also contributes to backend PnR and STA. His background blends academic research on low-power, low-latency on-chip interconnects and 3D integration with practical IP work on the PULP ecosystem and collaborations with STMicroelectronics, CEA, IMEC and ETH Zurich. Comfortable across Verilog/SystemVerilog/VHDL/SystemC and a wide ASIC toolchain, he pairs algorithmic low-power expertise with detailed physical implementation know-how. A less obvious strength is his track record of moving research concepts (3D NoC, TSV characterization, ultra-low-power multicore techniques) into multiple taped-out silicon platforms.
8 years of coding experience
9 years of employment as a software developer
Doctor of Philosophy (Ph.D.) in Electronic Engineering, Micrellab - DEIS - University of Bologna, Doctor of Philosophy (Ph.D.) in Electronic Engineering, Micrellab - DEIS - University of Bologna at Alma Mater Studiorum – Università di Bologna
Master's degree, Electrical, Electronics and Communications Engineering, Master's degree, Electrical, Electronics and Communications Engineering at Università degli Studi di Cagliari
60/60, Electronics and Automations, 60/60, Electronics and Automations at Istituto Tecnico Industriale Statale ITIS
Electronic Engineering, Electronic Engineering at Stanford University
Italian, English, French