Summary
Iris Chang is a NAND R&D Packaging Integration Engineer with a strong materials science foundation and 14 years of hands-on experience in semiconductor device engineering, thin film deposition, and material characterization. She holds an MS in Materials Science from UIUC and has driven integration work across leading fabs, including Intel and Solidigm, where she delivered high-yield hybrid bonding processes and led throughput improvements recognized with departmental awards. Her background spans MOCVD, ALD, PECVD, e-beam evaporation, advanced lithography and etch, and characterization techniques (SEM, TEM, XRD, Raman), paired with data analysis in MATLAB and Python. Iris has contributed to next-generation 2D material integration and CMOS-compatible flows at TSMC and refined MoTe2 growth in academic research, reflecting a rare blend of device-focused R&D and manufacturing ramp expertise. She is completing her MS in December and actively seeking full-time roles to bring process innovation from lab-scale demonstrations to high-volume manufacturing.
14 years of coding experience
3 years of employment as a software developer
Bachelor's degree, Material Science and Engineering, Bachelor's degree, Material Science and Engineering at National Chiao Tung University
Master's degree, Materials Science and Engineering, Master's degree, Materials Science and Engineering at University of Illinois Urbana-Champaign
English, Chinese