Summary
Jerry Chiang is a Substrate Module Development Integration Engineer with 14 years' experience across substrate and assembly houses, currently driving module integration at Intel in New Taipei. He has deep expertise in FCBGA quality and yield improvement, NPI process evaluation, reliability problem solving, and coordinating shipment schedules across vendors. His background spans hands-on R&D and operations—leading yield improvement programs, managing NPI yields, and developing new assembly products at companies including AMD and PTI. Known for bridging customer-facing roles and technical problem solving, he leverages cross-functional collaboration to translate field issues into process and design fixes. Holding an MSIS from Lawrence Technological University, he pairs practical manufacturing know-how with systems thinking to improve end-to-end substrate performance. A pragmatic engineer, he often uncovers subtle supply-chain or vendor-process gaps that unlock measurable yield gains.
14 years of coding experience
16 years of employment as a software developer
Master's degree, MSIS, Master's degree, MSIS at Lawrence Technological University