Jie Li is a Thermal Engineering Tech Leader with 11 years of multidisciplinary experience designing and delivering high-density thermal solutions for power electronics, data centers, EV charging, and medium-voltage systems. He combines deep CFD/FEA expertise (ANSYS, Fluent, Icepak, COMSOL) with hands-on hardware development of cold plates, CDUs, thermosyphons, immersion cooling and embedded heat pipes to shrink footprints and raise efficiency. At Eaton he led multiphysics modeling and prototyping for MV-SSTs, solid-state circuit breakers and aerospace liquid-cooled inverters, filing four patents on thermal management technologies. Now at Cisco in San Jose, he applies that power-electronics cooling pedigree to server-class and infrastructure platforms while also contributing electrical insulation design for MV applications. Unusually, Jie pairs advanced simulation and control-system experience (Modelica, Matlab/Dymola) with additive manufacturing for bespoke thermal components, enabling rapid iteration from model to tested prototype.
11 years of coding experience
22 years of employment as a software developer
Ph.D, Mechanical Engineering, Ph.D, Mechanical Engineering at North Carolina State University
Contributions:1 review, 1 PR, 3 pushes in 5 months
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