Summary
John Damasco is a Module Development Engineer at Intel with 11 years of experience translating advanced condensed-matter research into robust semiconductor manufacturing processes. A PhD physicist from UIUC, he led nanofabrication work on InSb nanowires—developing transparent metal contacts and tunnel junctions with implications for topological quantum devices—and built automation tools to streamline experimental data collection. At Intel he drives module development, automation, and ISO9001 compliance, improving technician workflows, maintenance predictability, and yield through data-driven SOP standardization and ALD expertise. He combines hands-on lab skills (e-beam lithography, RIE, epitaxy) with software automation (Python wrappers and fitting algorithms) to accelerate NPIs and troubleshoot complex integration issues. Based in Beaverton, OR, he pairs rigorous scientific problem solving with practical process engineering and a penchant for weightlifting, music, and deep reading—an indicator of disciplined curiosity beyond the cleanroom.
11 years of coding experience
6 years of employment as a software developer
University of Illinois Urbana-Champaign
B.S., Physics, B.S., Physics at University of California, Los Angeles
English, Chinese, French