Summary
Kazuaki A is a specialist and seasoned package and quality engineer with 12+ years driving semiconductor packaging, process development and manufacturing excellence across global teams at Texas Instruments, Dialog Semiconductor and Renesas. He blends deep technical expertise—thermo-compression bonding, Cu wire bonding, fan-out packaging, failure analysis with SEM/EPMA/FIB, and qualification to MIL-STD/AEC-Q/JEDEC—with proven cost-reduction and production launch leadership, including a tape-substrate program that halved costs. An organizational leader and coach, he applies MBO, competency-based talent development and ISO/IATF audit experience to scale multi-national engineering teams and operational improvements like TOC and DRBFM/APQP. His PhD research in risk assessment for new product development complements practical skills in statistical methods (Six Sigma, FMEA, ANOVA) and a prolific IP record with numerous international patents. Now based in Fukuoka and recently certified as an administrative procedural legal specialist, he brings a rare mix of technical rigor, regulatory savvy and cross-cultural management to complex product introductions.
12 years of coding experience
19 years of employment as a software developer
Associate's degree, Mechanical Engineering, Associate's degree, Mechanical Engineering at Kurume National College of Technology
Master of Business Administration (M.B.A.), Business Administration and Management, General, Master of Business Administration (M.B.A.), Business Administration and Management, General at Oita University
Doctor of Philosophy (PhD), Risk Assessment of New Product Development, Doctor of Philosophy (PhD), Risk Assessment of New Product Development at University of Tsukuba
Bachelor's degree, Business/Managerial Economics, Bachelor's degree, Business/Managerial Economics at Hosei University
English, Chinese