Summary
Lee Hooi is a Product Development Engineer and final-year Mechanical Engineering student at the University of Malaya, bringing eight years of hands-on experience across product development, internships, and student leadership roles. Currently at AMD and concurrently contributing at GTG Green Technologies, Lee blends mechanical design with practical coding skills (SQL, C++, Python, MATLAB, Arduino) to tackle engineering data analytics and stock-market interests. A high achiever academically (CGPA 3.94) and a practiced mentor and organizer, he has taught dynamics, thermodynamics, and fluid mechanics while leading external affairs and sponsorships for the faculty. Comfortable moving between lab, factory, and code, he pairs rigorous technical foundations with a curiosity for applied analytics and cross-disciplinary collaboration.
8 years of coding experience
1 year of employment as a software developer
7A+, 3A, 7A+, 3A at Chung Ling (National Type) High School 鍾靈(國民型)中學
CGPA 4.0, CGPA 4.0 at Perak Matriculation College
Bachelor's degree, Mechanical Engineering, CGPA 3.94, Bachelor's degree, Mechanical Engineering, CGPA 3.94 at University of Malaya