Summary
Li Bo is a seasoned hardware engineer with nine years of experience designing high-speed, high-density line cards and managing hardware architecture for carrier-grade router platforms. At ZTE he led board design for 10G–200G systems, drove a line card architecture and gateway hardware strategy, and improved TCAM interface verification with a more flexible Interlaken-LA reference module. He has a strong embedded-systems background from earlier work on TI 54x DSP-based radar simulator boards, including implementing a boot-from-flash routine that went into production. Recognized internally as an outstanding graduate and promoted to Level 2 Chief Engineer, he also mentors junior engineers and bridges hands-on design with system-level ownership. Based in the Greater Nanjing Area, he combines practical DSP/board-level expertise with proven architectural leadership across telecom hardware projects.
9 years of coding experience
3 years of employment as a software developer
Bachelor of Electronic information science and technology, Electronic Science and Engineering, Bachelor of Electronic information science and technology, Electronic Science and Engineering at Nanjing University