Masayuki Ohi
Module Process Engineering at Apple
Japan
Summary
👤
Senior🎓
Top SchoolMasayuki Ohi is a seasoned module process engineer with 14 years of experience in high-volume manufacturing and package development for plastic semiconductor packages, wafer-level packages, and flip chip applications. Currently at Apple, he leads assembly process development for optical and sensor modules, bringing deep expertise in wafer bumping and 300mm processor HVM. His background spans senior technical and business roles at Amkor, Sony, and Apack Technology, combining hands-on process R&D with customer-facing promotion and supply-chain collaboration. He has a track record of developing new materials and collaborating with suppliers to improve manufacturability and reliability in module assembly. Known for bridging laboratory organic-chemistry insight with large-scale production, he uniquely translates material science into scalable manufacturing solutions. Based in Japan, he pairs technical depth with practical commercial experience in bringing complex packaging technologies to market.
14 years of coding experience
12 years of employment as a software developer
Bachelor's degree, Organic Chemistry, Bachelor's degree, Organic Chemistry at 明治大学
Github Skills (28)
go-api9
api9
sidekiq-cron8
digitalocean8
api-client8
cron7
golang7
sidekiq7
ruby-on-rails7
fastly7
go6
rails6
scheduler6
ruby6
caching5
Programming languages (4)
Github contributions (5)
manba-inc/fastly-rails
Sep 2019 - Mar 2025
Rails plugin for Fastly dynamic caching
Contributions:6 PRs, 20 pushes, 10 branches in 5 years 6 months
fastlyrailscachingrubyrails-plugin
masayukioguni/godo-cli
May 2015 - Nov 2015
Contributions:43 commits, 69 PRs, 62 pushes in 6 months
command-line-toolapidropletsdigitalocean-dropletsdigitalocean-api
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