Mengbing Liang is an advanced packaging technologist with 11 years of experience developing IC and module-level packaging solutions across industry leaders including MediaTek, Apple, and Intel. He led process engineering for Apple's Vision Pro PPO module and previously drove equipment and packaging R&D at Intel, blending hands-on process development with systems-level packaging integration. Holding a Ph.D. in Electrical and Electronics Engineering from Arizona State University, he brings deep MEMS fabrication and sensor experience from academic research into commercial high-density packaging. Based in Sunnyvale, he focuses on pushing assembly and module reliability boundaries for next-generation products, often bridging novel research concepts with manufacturable processes. Notably, his background spans both space/planetary MEMS instrumentation and consumer AR hardware, an uncommon cross-domain perspective that informs pragmatic yet innovative packaging solutions.
11 years of coding experience
13 years of employment as a software developer
Doctor of Philosophy (Ph.D.) Electrical and Electronics Engineering, Doctor of Philosophy (Ph.D.) Electrical and Electronics Engineering at Arizona State University
Bachelor of Engineering (B.E.) Electrical and Electronics Engineering, Bachelor of Engineering (B.E.) Electrical and Electronics Engineering at Huazhong University of Science and Technology
Contributions:14 commits, 10 PRs, 37 pushes in 3 months
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