Summary
Myungjun Lee is a Corporate VP and engineering leader with a decade of hands-on experience driving advanced metrology, inspection, and optical system development for semiconductor imaging, sensing and lithography at Samsung and prior roles at KLA-Tencor and GlobalFoundries. He combines deep academic training (PhD in Optical Sciences) with prolific innovation—55+ publications, over 30 US patents, SPIE senior membership and leadership on major conference committees—to translate computational lithography and optical imaging research into production tools for leading-edge logic, memory and 3D packaging. Known for developing high-end systems from bright-field inspectors to hyperspectral and holographic imaging, he has repeatedly turned complex physics and algorithms into core IP and manufacturable metrology solutions. Based in Seoul, he leads next-generation MI efforts for 2.3D/2.5D packaging, HBM and future 3D DRAM/V-NAND, blending scientific curiosity with product-focused execution. An interesting through-line in his career is bridging academic prototype work (e.g., holographic imaging in Ozcan’s lab) directly into industry-scale instrumentation and process control.
11 years of coding experience
8 years of employment as a software developer
The University of Arizona
BS, EE, BS, EE at Korea University
Master of Science - MS, Electrical Engineering (EE), Master of Science - MS, Electrical Engineering (EE) at Texas A&M University