Patrick Kim is a principal engineer specializing in advanced electronic packaging with 12+ years of focused industry experience and a Ph.D. in Materials Science from UCLA. He has led package development, qualification, and cross-functional customer engagements across flip chip, WLCSP, wafer bumping, 2.5D/3D and MEMS sensor packages at top-tier companies including Samsung, AMD, Micron and TDK InvenSense. His work spans hands-on failure analysis, metallurgy and Pb‑free solder research through to product management, technology marketing and roadmap strategy, resulting in numerous patents and publications. Known for closing complex reliability issues by pairing simulation-driven mechanical/thermal/SI analysis with manufacturing root-cause work, he consistently translates materials science insights into production-ready solutions. Based in San Jose, he brings rare depth in wafer-level processes and TSV/HMC integration that shortens qualification cycles and de‑risks new package launches.
12 years of coding experience
23 years of employment as a software developer
Bachelor of Science (B.S.) Metallurgical Engineering, Bachelor of Science (B.S.) Metallurgical Engineering at Inha University
Memory optimized JavaScript Engine for Lightweight Web Engine
Contributions:1987 pushes, 109 branches in 6 years 1 month
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Patrick Kim - Pincipal Engineer at Samsung Semiconductor