Reed Terdal is a Senior Silicon Design Engineer with eight years of experience designing high-performance CPU front-end microarchitecture, currently focusing on PPA-driven enhancements at AMD. He has deep RTL expertise in branch prediction and instruction cache development for Zen cores and a strong background in embedded systems, sensor calibration, and RTOS-driven hardware-software integration from RIT and industry co-ops. Reed combines academic teaching experience in C programming with hands-on PCB, driver, and calibration tool development for NASA-related imaging projects, highlighting an ability to span firmware to silicon. Based in Burlington, MA, he blends rigorous EE/CS training with pragmatic delivery in production CPU design, and he often brings cross-domain insights from embedded verification and photonics test automation into microarchitectural problem solving.
8 years of coding experience
5 years of employment as a software developer
Bachelor's degree Electrical and Electronics Engineering Computer Science, Bachelor's degree Electrical and Electronics Engineering Computer Science at Rochester Institute of Technology
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Reed Terdal - Senior Silicon Design Engineer at AMD