Renliang Yuan
Senior Failure Analysis Engineer at NVIDIA
California, United States
Summary
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Senior🎓
Top SchoolRenliang Yuan is a Senior Failure Analysis Engineer with 11 years of experience applying advanced electron microscopy, machine learning, and data analytics to semiconductor failure analysis and yield development. He has driven new technology development across cutting-edge nodes and packaging at Intel and now focuses on next-generation failure analysis at NVIDIA, with deep hands-on expertise in TEM, PFIB, SEM/FIB, and nanoprobers. His Ph.D. work at UIUC produced a sub-nm strain measurement technique and validated AI+physics approaches for 4D-STEM, bridging academic research and high-volume manufacturing challenges. Renliang has a track record of automating high-throughput TEM imaging and chemical mapping for production programs like Intel Optane and advanced packaging, and he routinely collaborates with vendors, national labs, and universities to co-develop novel toolsets. Fluent in both experimental condensed-matter methods and practical device-level diagnostics, he also holds dual undergraduate degrees in Physics and Economics from Peking University, an uncommon combination that supports technical problem solving with business-minded perspective.
11 years of coding experience
9 years of employment as a software developer
Bachelor of Science (B.S.) Physics, Bachelor of Science (B.S.) Physics at Peking UniversityDoctor of Philosophy (Ph.D.) Materials Science, Doctor of Philosophy (Ph.D.) Materials Science at University of Illinois Urbana-ChampaignShanghai High School
English, ChineseGithub contributions (5)
flysteven/flysteven.github.io
Apr 2015 - Apr 2017
Contributions:119 pushes in 2 years
flysteven/imToolBox
Jan 2021 - Apr 2021
Contributions:10 commits, 9 pushes, 1 branch in 2 months
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