Sr. Principal Product Engineer at Cadence Design Systems
Seoul Incheon Metropolitan Area South Korea
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Summary
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Sang-hyun Lee is a senior principal product engineer with 13 years in R&D and leadership across the semiconductor and advanced packaging industries, now driving product work at Cadence Design Systems. He combines deep technical expertise in thin films, microfabrication, and semiconductor packaging with hands-on program leadership developed as VP at Amkor Technology and principal engineer roles at Samsung. His work spans 3D TSV, 2.5D, fan-out WLP and novel package platforms, reflecting a track record of moving concepts from lab-scale MEMS and bonding processes to high-volume manufacturing. Holding a PhD in Electrical Engineering from the University of Michigan and advanced degrees in materials and metallurgical engineering, he bridges materials science and device-level electrical engineering. Based in Seoul/Incheon, he is known for translating cross-disciplinary research into commercial package innovations and for mentoring teams through complex technology transitions. A not-obvious strength is his background in ink-jet MEMS and wafer-level bonding, which informs creative approaches to packaging challenges.
13 years of coding experience
15 years of employment as a software developer
PhD, Electrical Engineering, PhD, Electrical Engineering at University of Michigan
BE, Metallurgical Engineering, BE, Metallurgical Engineering at Korea University
Electrical Engineering, Electrical Engineering at The Ohio State University
MS, Material Science, MS, Material Science at Korea Advanced Institute of Science and Technology
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Sang-hyun Lee - Sr. Principal Product Engineer at Cadence Design Systems