Summary
Sangwon Lee is a seasoned process and integration engineer with 10+ years of experience driving yield, defect reduction, and productivity improvements across DRAM, logic, AMOLED and flexible digital X‑ray detector manufacturing. Based in Hillsboro, Oregon, he combines hands‑on tool ownership in high‑volume fabs with NPI leadership—creating lithography/metrology recipes, qualifying equipment, and managing lot and reticle inventories to enable smooth scale‑ups. His track record includes solving elusive yield issues (e.g., line‑end shortening, shot artifacts, photoresist reflow) and introducing process and packaging innovations such as low‑k BCB passivation for moisture resistance. Known for pragmatic root‑cause analysis and cross‑discipline collaboration with AOI, IT and vendors, he repeatedly turns data‑driven insights into production wins.
10 years of coding experience
26 years of employment as a software developer
Master, Physics, 3.22/4.3, Master, Physics, 3.22/4.3 at Pohang University of Science and Technology
Bachelor, Physics, 3.35/4.0, Bachelor, Physics, 3.35/4.0 at Yonsei University
English, Korean