Summary
Saurabh Singh is a seasoned process engineer with 13 years of experience in semiconductor and thin-film technologies, currently driving PVD process development at ASMPT NEXX. He holds a Master's in Chemical Engineering from University at Buffalo and is a Six Sigma Green Belt, combining rigorous academic training with practical process optimization skills. His background spans ALD, MBE, sputter and ion-beam depositions, advanced characterization (SEM, XRD, TEM, Hall), and both dry and wet etch processes—work cultivated during a research-intensive stint at IBM T.J. Watson and graduate nanoparticle synthesis projects. Saurabh has led cross-disciplinary efforts to develop novel testable chip packaging (space transformer) and worked on thin-film photovoltaics and Li-ion devices, showing an ability to translate lab-scale science into manufacturable processes. Known for pairing hands-on tool expertise with data-driven DOE and scale-up experience, he brings a pragmatic problem-solving style to complex fabrication challenges. Based in Billerica, MA, he blends research curiosity with production-level execution, often spotting process improvements that reduce cycle time or variability.
13 years of coding experience
4 years of employment as a software developer
Master's degree, Chemical Engineering, Master's degree, Chemical Engineering at University at Buffalo
Bachelor; H.B.T.I, Chemical Engineering; Kanpur, Bachelor; H.B.T.I, Chemical Engineering; Kanpur at Harcourt Butler Technological Institute
English, Hindi