Summary
Shih Lin is an Application Engineer with 9 years in semiconductor process and applications, combining five years supporting EUV systems at ASML with four years as a diffusion RTP process engineer. He specializes in translating customer needs into validated tool functions, driving pre-sales demos, feasibility studies, and on-site installations that helped create business opportunities and earned TSMC appreciation. Technically fluent in data analysis with strong Excel, MATLAB, and Python skills, he has improved metrology sensor stability and evaluated advanced wafer table betas to boost inline yield and accuracy. Known for practical troubleshooting, he codified best-known-methods to raise team issue-resolution efficiency and regularly partners with design and system engineers to close capability gaps. Based in Hsinchu, Taiwan, he combines technical rigor from a Master’s in Electrical and Photonic Engineering with a collaborative, customer-focused approach to product lifecycle delivery.
9 years of coding experience
4 years of employment as a software developer
Bachelor's degree, Electrical and Electronics Engineering, Bachelor's degree, Electrical and Electronics Engineering at National Taiwan University of Science and Technology
Master's degree, Department of Electrical and Photonic Engineering, Master's degree, Department of Electrical and Photonic Engineering at National Yang Ming Chiao Tung University