Sisi Cao is a materials scientist and TD Module Integration & Yield Engineer at Intel with 11 years of experience bridging PhD-level research and cleanroom device fabrication. She specializes in materials characterization, synthesis of inorganic/organic nanostructures, and nano-/micro-fabrication of microelectronic and photonic devices, with a proven track record in data-driven yield improvement. Her background includes senior research work at Brewer Science and advanced degrees (MS, PhD) from Washington University in St. Louis, grounded in a bachelor’s from Hunan University. Sisi combines hands-on experimental skill with quantitative analysis to translate lab-scale innovations into manufacturable processes. Based in Hillsboro, Oregon, she brings both academic rigor and practical manufacturing experience to semiconductor integration challenges.
11 years of coding experience
Doctor of Philosophy (PhD), Materials Science, Doctor of Philosophy (PhD), Materials Science at Washington University in St. Louis
Bachelor's degree, Materials Science and Engineering, Bachelor's degree, Materials Science and Engineering at Hunan University
Contributions:9 commits, 6 pushes, 1 branch in 1 year 7 months
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