Tian Qiu
IC Packaging Design Lead at Google
Sunnyvale, California, United States
Summary
👤
Senior🎓
Top SchoolTian Qiu is an IC packaging design lead with 8 years of hands-on experience in advanced packaging, system-level SI/PI, PCB and antenna design, currently driving packaging solutions at Google from Sunnyvale. He built package architectures and heterogeneous chiplet integrations at Intel, delivering products that combined optical dies, ADCs, transceivers and AI accelerators while optimizing cost, form factor and thermal/material stacks. Tian blends analog/RF circuit know-how with substrate-level electromagnetic and antenna design, and has co-developed SI/PI automation tools to accelerate design review and verification. Comfortable spanning research to manufacturing, he has deep experience in EMIB, silicon photonics and antenna-in-package implementations, and a track record of translating system requirements into manufacturable package templates and routing strategies.
8 years of coding experience
1 year of employment as a software developer
Bachelor's degree, Electrical and Electronics Engineering, Bachelor's degree, Electrical and Electronics Engineering at Xidian UniversityMaster's degree, Electrical and Electronics Engineering, Master's degree, Electrical and Electronics Engineering at University of Pennsylvania
English, ChineseProgramming languages (1)
Github contributions (5)
leonardoqt/GCMC_cpp
May 2019 - Sep 2021
Contributions:26 commits in 2 years 3 months
leonardoqt/polyhedron_volume
Aug 2018 - Nov 2019
Contributions:2 commits in 1 year 3 months
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