Tien Hsin is a senior hardware engineer based in New Taipei with 11 years of experience designing and validating CPU COMe/COM-HPC boards and embedded systems. He has led circuit design, simulation, and EVT/DVT testing while coordinating closely with layout, mechanical teams, and contract manufacturers to bring new CPU SKUs from block diagrams to production. His background spans automotive HUD and lidar hardware, FPGA-to-ARM interface programming, and hands-on system integration and customer support. Known for blending hardware design with firmware and test engineering, he often handles procurement and material verification personally to ensure manufacturability. Comfortable working across cross-functional teams, he consistently translates complex specs into robust, testable hardware.
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