Summary
Trevor Olson is a seasoned technology leader with 14+ years driving tape head research, development, and operations at Western Digital, currently serving as Senior Director. He blends deep expertise in semiconductor physics and process integration with strong data-driven decision making—FMEA, SPC/APC, multivariate modeling—and hands-on coding in C/C++, Java, Matlab, SQL, and scripting. Trevor has steadily progressed from hands-on ion mill and wafer integration engineering to senior leadership roles, pairing lab-level experience in thin-film deposition and metrology with program management and cost-based tradeoffs. Known for a pragmatically curious approach—“tastes like coffee and physics”—he leverages statistical tools like JMP and Mathematica to turn failure analysis into repeatable yield improvements. Located in San Jose, he bridges research rigor and manufacturing scale to deliver robust, manufacturable tape head technologies.
14 years of coding experience
20 years of employment as a software developer
BS,BS,BS, Physics, Mathematics, Computer Science, BS,BS,BS, Physics, Mathematics, Computer Science at University of Washington
Physics, Physics at Cornell University