Wang Jie is a manufacturing engineer with nine years of hands-on experience across high-precision industries, currently focused on manufacturing at SLB after a recent role improving wirebond module yields at ASMPT. He combines mechanical engineering rigor from an NUS honours degree with practical skills in CAD, CAM, jigs/fixture design and process optimization—having driven a testing yield lift from 30% to 90% in three months. Comfortable bridging R&D and production, he has led cross-company assembly projects and contributed tooling libraries and 3D-printed safety solutions at TechnipFMC. An avid tinkerer and Java enthusiast, he brings a systems mindset to thermal and engine-based problems and prioritizes clear communication, efficiency and continuous learning in his engineering practice.
9 years of coding experience
3 years of employment as a software developer
A levels, Physics, Chemistry, Math, Economics, A levels, Physics, Chemistry, Math, Economics at Nanyang Junior College
O levels, O levels at Chung Cheng High School (Main)
Bachelor of Engineering (Honors), Mechanical Engineering, Bachelor of Engineering (Honors), Mechanical Engineering at National University of Singapore
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