Summary
Wenbo Hou is a Senior Failure Analysis Engineer and team leader with 10+ years of experience applying materials science and advanced microscopy to semiconductor yield and reliability challenges. At Intel he leads TEM-based root-cause investigations, collaborates cross-functionally to implement corrective actions, and mentors engineers and technicians on metrology and SPC/DOE best practices. His academic background (PhD, USC) and postdoctoral work blend photocatalysis, thin-film synthesis, and nanomaterials—skills he has applied to photoelectrochemical devices and catalytic systems. Wenbo combines deep hands-on expertise in instrumentation troubleshooting and statistical analysis with a researcher's curiosity for surface chemistry and plasmon-enhanced photocatalysis. Based in Hillsboro, Oregon, he is actively seeking challenging research or engineering roles spanning thin film deposition, device fabrication, renewable energy, and nanotechnology. An uncommon strength is his track record of translating fundamental catalysis and nanomaterial insights into practical failure-analysis and metrology improvements in high-volume semiconductor manufacturing.
10 years of coding experience
20 years of employment as a software developer
PhD Chemistry, PhD Chemistry at University of Southern California
B.S. M.S Chemistry, B.S. M.S Chemistry at Beijing Normal University
MS Chemistry, MS Chemistry at University of Saskatchewan
Chinese