Summary
Xinghua Liu is a Process Integration Manager with a decade of experience at Intel, specializing in 3D NAND cell process sustaining and yield enhancement. He has led multiple advanced technology startups and technology transfers, including F68/F68A greenfield launches, RTD advanced nodes, and silicon photonics initiatives. Known for mentoring new PI engineers and driving sustaining excellence, he blends hands-on process development with operational leadership to improve TO3 quality and yield metrics. His background includes developing InP bonding and bulk removal for silicon photonics on 12-inch lines, demonstrating cross-domain expertise in both memory and photonics manufacturing. Holding a Ph.D. in Microelectronics and a bachelor's in Materials Science, he brings deep research foundations to high-volume fab challenges. Based in Liaoning, China, he pairs academic rigor with pragmatic problem solving and a persistent focus on production-ready process robustness.
10 years of coding experience
7 years of employment as a software developer
Doctor of Philosophy (Ph.D.), Microelectronics, Doctor of Philosophy (Ph.D.), Microelectronics at University of Chinese Academy of Sciences
Bachelor's degree, material science and engineering, Bachelor's degree, material science and engineering at Beihang University