Summary
Xingping Li is a seasoned engineering leader with 11+ years in BSP and embedded systems, currently directing engineering for Qualcomm’s China customer support team in Shenzhen. He combines deep hands-on expertise in ARM platforms, real-time OS, C, boot/memory/storage drivers (NAND/eMMC), power and stability debugging, and emerging mobile security solutions with proven team and customer-management skills. Over the past seven years he has led resolution of numerous critical, complex, and time-sensitive stability issues, pairing technical depth with rigorous methodology. Comfortable both as a hands-on troubleshooter and as a small-to-medium team manager, he bridges customer needs and engineering delivery. Known for a pragmatic, happiness-oriented approach to work, he brings steady leadership to high-pressure support and security challenges.
11 years of coding experience
3 years of employment as a software developer
Bachelor of Engineering (BE), auto control, Bachelor of Engineering (BE), auto control at Nankai University
English, Chinese