Summary
Yin Huang is a TD Engineer at Intel with six years of interdisciplinary experience bridging plasma science, semiconductor process development, and nanophotonic device engineering. He earned his PhD at the University of Illinois Urbana-Champaign and has a track record developing microplasma diagnostics, VUV photolithography for sub-500 nm nanostructures, and microfabricated 3D plasma photonic crystals for GHz–THz filtering. His research created novel devices such as microplasma-semiconductor transistors, strain‑rolled microresonators with quantum dots, and back-to-back frequency modulators that reveal controllable microplasma nonlinearities. Skilled in nano/micro characterization and electromagnetic simulation, he combines CMOS-compatible fabrication with 3D printing to explore plasma-driven material processing inside electron microscopes—an uncommon hands-on integration of fabrication, measurement, and simulation. Based in Urbana, Illinois, he brings a researcher's curiosity and an engineer’s focus on translating exotic physics into practical device concepts.
6 years of coding experience
5 years of employment as a software developer
Master of Science (M.S.), Electrical and Electronics Engineering, Master of Science (M.S.), Electrical and Electronics Engineering at Iowa State University
University of Illinois Urbana-Champaign